| 作者 |
| Eric Bogatin （美）Eric Bogatin（埃里克 ？ 伯格丁） |
| 丛书名 |
| 国外电子与通信教材系列 |
| 出版社 |
| 电子工业出版社 |
| ISBN |
| 9787121407833 |
| 简要 |
| 简介 |
| 内容简介 本书全面论述了信号完整性与电源完整性问题。主要讲述信号与电源完整性分析及物理设计概论，4类信号与电源完整性问题的实质含义，物理互连设计对信号完整性的影响，电容、电感、电阻和电导的特性分析，求解信号与电源完整性问题的4种实用技术途径，推导和仿真背后隐藏的解决方案，以及改进信号与电源完整性的推荐设计准则等。本书还讨论了信号与电源完整性中S参数的应用问题，并给出了电源分配网络的设计实例。本书强调直觉理解、实用工具和工程素养。作者以实践专家的视角指出造成信号与电源完整性问题的根源，并特别给出了设计阶段前期的问题解决方案。 |
| 目录 |
| Chapter 1 Signal Integrity Is in Your Future 1．1 What Are Signal Integrity， Power Integrity， and Electromagnetic Compatibility 1．2 Signal-Integrity Effects on One Net 1．3 Cross Talk 1．4 Rail-Collapse Noise 1．5 ElectroMagnetic Interference (EMI) 1．6 Two Important Signal-Integrity Generalizations 1．7 Trends in Electronic Products 1．8 The Need for a New Design Methodology 1．9 A New Product Design Methodology 1．10 Simulations 1．11 Modeling and Models 1．12 Creating Circuit Models from Calculation 1．13 Three Types of Measurements 1．14 The Role of Measurements 1．15 The Bottom Line Chapter 2 Time and Frequency Domains 2．1 The Time Domain 2．2 Sine Waves in the Frequency Domain 2．3 Shorter Time to a Solution in the Frequency Domain 2．4 Sine-Wave Features 2．5 The Fourier Transform 2．6 The Spectrum of a Repetitive Signal 2．7 The Spectrum of an Ideal Square Wave 2．8 From the Frequency Domain to the Time Domain 2．9 Effect of Bandwidth on Rise Time 2．10 Bandwidth and Rise Time 2．11 What Does Significant Mean 2．12 Bandwidth of Real Signals 2．13 Bandwidth and Clock Frequency 2．14 Bandwidth of a Measurement 2．15 Bandwidth of a Model 2．16 Bandwidth of an Interconnect 2．17 The Bottom Line Chapter 3 Impedance and Electrical Models 3．1 Describing Signal-Integrity Solutions in Terms of Impedance 3．2 What Is Impedance 3．3 Real Versus Ideal Circuit Elements 3．4 Impedance of an Ideal Resistor in the Time Domain 3．5 Impedance of an Ideal Capacitor in the Time Domain 3．6 Impedance of an Ideal Inductor in the Time Domain 3．7 Impedance in the Frequency Domain 3．8 Equivalent Electrical Circuit Models 3．9 Circuit Theory and SPICE 3．10 Introduction to Measurement-Based Modeling 3．11 The Bottom Line Chapter 4 The Physical Basis of Resistance 4．1 Translating Physical Design into Electrical Performance 4．2 The Only Good Approximation for the Resistance of Interconnects 4．3 Bulk Resistivity 4．4 Resistance per Length 4．5 Sheet Resistance 4．6 The Bottom Line Chapter 5 The Physical Basis of Capacitance 5．1 Current Flow in Capacitors 5．2 The Capacitance of a Sphere 5．3 Parallel Plate Approximation 5．4 Dielectric Constant 5．5 Power and Ground Planes and Decoupling Capacitance 5．6 Capacitance per Length 5．7 2D Field Solvers 5．8 Effective Dielectric Constant 5．9 The Bottom Line Chapter 6 The Physical Basis of Inductance 6．1 What Is Inductance 6．2 Inductance Principle 1： There Are Circular Rings of Magnetic-Field Lines Around All Currents 6．3 Inductance Principle 2： Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It 6．4 Self-Inductance and Mutual Inductance 6．5 Inductance Principle 3： When the Number of Field Line Rings Around a Conductor Changes， There Will Be a Voltage Induced Across the Ends of the Conductor 6．6 Partial Inductance 6．7 Effective， Total， or Net Inductance and Ground Bounce 6．8 Loop Self- and Mutual Inductance 6．9 The Power Distribution Network (PDN) and Loop Inductance 6．10 Loop Inductance per Square of Planes 6．11 Loop Inductance of Planes and Via Contacts 6．12 Loop Inductance of Planes with a Field of Clearance Holes 6．13 Loop Mutual Inductance 6．14 Equivalent Inductance of Multiple Inductors 6．15 Summary of Inductance 6．16 Current Distributions and Skin Depth 6．17 High-Permeability Materials 6．18 Eddy Currents 6．19 The Bottom Line Chapter 7 The Physical Basis of Transmission Lines 7．1 Forget the Word Ground 7．2 The Signal 7．3 Uniform Transmission Lines 7．4 The Speed of Electrons in Copper 7．5 The Speed of a Signal in a Transmission Line 7．6 Spatial Extent of the Leading Edge 7．7 “Be the Signal” 7．8 The Instantaneous Impedance of a Transmission Line 7．9 Characteristic Impedance and Controlled Impedance 7．10 Famous Characteristic Impedances 7．11 The Impedance of a Transmission Line 7．12 Driving a Transmission Line 7．13 Return Paths 7．14 When Return Paths Switch Reference Planes 7．15 A First-Order Model of a Transmission Line 7．16 Calculating Characteristic Impedance with Approximations 7．17 Calculating the Characteristic Impedance with a 2D Field Solver 7．18 An n-Section Lumped-Circuit Model 7．19 Frequency Variation of the Characteristic Impedance 7．20 The Bottom Line Chapter 8 Transmission Lines and Reflections 8．1 Reflections at Impedance Changes 8．2 Why Are There Reflections 8．3 Reflections from Resistive Loads 8．4 Source Impedance 8．5 Bounce Diagrams 8．6 Simulating Reflected Waveforms 8．7 Measuring Reflections with a TDR 8．8 Transmission Lines and Unintentional Discontinuities 8．9 When to Terminate 8．10 The Most Common Termination Strategy for Point-to-Point Topology 8．11 Reflections from Short Series Transmission Lines 8．12 Reflections from Short-Stub Transmission Lines 8．13 Reflections from Capacitive End Terminations 8．14 Reflections from Capacitive Loads in the Middle of a Trace 8．15 Capacitive Delay Adders 8．16 Effects of Corners and Vias 8．17 Loaded Lines 8．18 Reflections from Inductive Discontinuities 8．19 Compensation 8．20 The Bottom Line Chapter 9 Lossy Lines， Rise-Time Degradation， and Material Properties 9．1 Why Worry About Lossy Lines 9．2 Losses in Transmission Lines 9．3 Sources of Loss： Conductor Resistance and Skin Depth 9．4 Sources of Loss： The Dielectric 9．5 Dissipation Factor 9．6 The Real Meaning of Dissipation Factor 9．7 Modeling Lossy Transmission Lines 9．8 Characteristic Impedance of a Lossy Transmission Line 9．9 Signal Velocity in a Lossy Transmission Line 9．10 Attenuation and dB 9．11 Attenuation in Lossy Lines 9．12 Measured Properties of a Lossy Line in the Frequency Domain 9．13 The Bandwidth of an Interconnect 9．14 Time-Domain Behavior of Lossy Lines 9．15 Improving the Eye Diagram of a Transmission Line 9．16 How Much Attenuation Is Too Much 9．17 The Bottom Line Chapter 10 Cross Talk in Transmission Lines 10．1 Superposition 10．2 Origin of Coupling： Capacitance and Inductance 10．3 Cross Talk in Transmission Lines： NEXT and FEXT 10．4 Describing Cross Talk 10．5 The SPICE Capacitance Matrix 10．6 The Maxwell Capacitance Matrix and 2D Field Solvers 10．7 The Inductance Matrix 10．8 Cross Talk in Uniform Transmission Lines and Saturation Length 10．9 Capacitively Coupled Currents 10．10 Inductively Coupled Currents 10．11 Near-End Cross Talk 10．12 Far-End Cross Talk 10．13 Decreasing Far-End Cross Talk 10．14 Simulating Cross Talk 10．15 Guard Traces 10．16 Cross Talk and Dielectric Constant 10．17 Cross Talk and Timing 10．18 Switching Noise 10．19 Summary of Reducing Cross Talk 10．20 The Bottom Line Chapter 11 Differential Pairs and Differential Impedance 11．1 Differential Signaling 11．2 A Differential Pair 11．3 Differential Impedance with No Coupling 11．4 The Impact from Coupling 11．5 Calculating Differential Impedance 11．6 The Return-Current Distribution in a Differential Pair 11．7 Odd and Even Modes 11．8 Differential Impedance and Odd-Mode Impedance 11．9 Common Impedance and Even-Mode Impedance 11．10 Differential and Common Signals and Odd- and Even-Mode Voltage Components 11．11 Velocity of Each Mode and Far-End Cross Talk 11．12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair 11．13 Measuring Even- and Odd-Mode Impedance 11．14 Terminating Differential and Common Signals 11．15 Conversion of Differential to Common Signals 11．16 EMI and Common Signals 11．17 Cross Talk in Differential Pairs 11．18 Crossing a Gap in the Return Path 11．19 To Tightly Couple or Not to Tightly Couple 11．20 Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements 11．21 The Impedance Matrix 11．22 The Bottom Line Chapter 12 S-Parameters for Signal-Integrity Applications 12．1 S-Parameters， the New Universal Metric 12．2 What Are S-Parameters 12．3 Basic S-Parameter Formalism 12．4 S-Parameter Matrix Elements 12．5 Introducing the Return and Insertion Loss 12．6 A Transparent Interconnect 12．7 Changing the Port Impedance 12．8 The Phase of S21 for a Uniform 50-Ohm Transmission Line 12．9 The Magnitude of S21 for a Uniform Transmission Line 12．10 Coupling to Other Transmission Lines 12．11 Insertion Loss for Non-50-Ohm Transmission Lines 12．12 Data-Mining S-Parameters 12．13 Single-Ended and Differential S-Parameters 12．14 Differential Insertion Loss 12．15 The Mode Conversion Terms 12．16 Converting to Mixed-Mode S-Parameters 12．17 Time and Frequency Domains 12．18 The Bottom Line Chapter 13 The Power Distribution Network (PDN) 13．1 The Problem 13．2 The Root Cause 13．3 The Most Important Design Guidelines for the PDN 13．4 Establishing the Target Impedance Is Hard 13．5 Every Product Has a Unique PDN Requirement 13．6 Engineering the PDN 13．7 The VRM 13．8 Simulating Impedance with SPICE 13．9 On-Die Capacitance 13．10 The Package Barrier 13．11 The PDN with No Decoupling Capacitors 13．12 The MLCC Capacitor 13．13 The Equivalent Series Inductance 13．14 Approximating Loop Inductance 13．15 Optimizing the Mounting of Capacitors 13．16 Combining Capacitors in Parallel 13．17 Engineering a Reduced Parallel Resonant Peak by Adding More Capacitors 13．18 Selecting Capacitor Values 13．19 Estimating the Number of Capacitors Needed 13．20 How Much Does a nH Cost 13．21 Quantity or Specific Values 13．22 Sculpting the Impedance Profiles： The Frequency-Domain Target Impedance Method (FDTIM) 13．23 When Every pH Counts 13．24 Location， Location， Location 13．25 When Spreading Inductance Is the Limitation 13．26 The Chip View 13．27 Bringing It All Together 13．28 The Bottom Line Appendix A 100+ General Design Guidelines to Minimize Signal-Integrity Problems Appendix B 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects Appendix C Selected References |